1> Ceramic Substrate can be 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO), thickness range: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Thicker thickness such as 1.6mm or 2.0mm can be customized too.
2> Conductor layer materail is silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone);
3> Thickness of conductor >= 10 miron (um), and Max can be 20 micron (0.02mm)
4> Min trace width and space for volume production:0.30mm & 0.30mm, 0.20mm/0.20mm is also okay but cost will be higher, and 0.15mm/0.20mm only available for prototype.
5> Tolerance for final trace layout will be +/-5%
6> Both gold and silver palladium is workable for gold-wire bonding, but customer need to mention that so that we will use special silver palladium which is suitable for that artwork.
7> More different resistor value on the same board, more expensive board will be
8> Normally layers are 1L and 2L (with plated through hole (PTH), and plated material is the same like the one used for conductor), and maximum layers can be 10 layers
9> Soldermask is also available upon request, working temperature >500 C, and color is semi-transparent.
10> Lead out: SIP and DIP, Pitch2.54mm and1.78mm
11> Die assembly and AI wedge bonding