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Thick Film Hybrid Circuit

What is Thick Film Hybrid Circuit ?

Thick Film Hybrid Circuit also calls Thick Film Resistor Hybrid Circuit is the physical realization of an electronic circuit from two or more discrete circuit elements, like integrated circuits, transistors, diodes, resistors, capacitors, transformers and conductors. These are usually mounted on an insulating ceramic substrate to produce circuit functions similar to but with advantages over monolithic integrated circuits. Thick Film Hybrid Circuits are made with the substrate depositions designed and fabricated by screen printing; and then firing of layers of highly viscous pastes composed of noble metal powders, vitreous binders etc.

Thick Film Hybrid Circuit Technology is ideally suited when quick turnaround is required for complex, high density multi-layer, low cost, high volume applications. It is also extremely effective for development work, quite often surpassing PCB turnaround. The ability to print resistors, capacitors, and inductors on ceramic based substrates allows for increased package density and reliability.

Thick Film Hybrid Circuit has the advantages of circuit miniaturization together with increased reliability, low weight and Low cost. By using a Thick Film circuit instead of a PCB many benefits are gained – reduced component count, lower assembly costs, and quicker assembly/test times along with increased reliability. The characteristics of Thick Film Resistor Hybrid Circuit make it highly applicable to Commercial, Industrial, Scientific and Military applications.

Based on Thick Film Hybrid Circuit Technology, we can put resistor, electric capacity, conductor, semi-conductor, and interchangable conductor on ceramic board, after manufacturing steps of printing and high temperature sintering.The resistors can be laser trimming with high tolerance condition, So we can make all the resistors with the same value, or different value for different resistor on the same board.

Thick Film Hybrid Circuit is a new material that will improve the process of embedded resistors by eliminating the need for special termination treatment, such as immersion silver,or silver palladium, gold palladium, Also speed up the laser trim process with tighter TCR’s; and increase the reliability performance with a stable binder system.

Thick Film Hybrid Circuit Technology achieves this with the ability to produce integrated resistors of small size, planar 2D construction, with high reliability, high power density and high stability. This means that resistors can be made as small as 1mm square with no significant thickness. Another added bonus is that the resistors are not limited to preferred values. Almost any value is possible from less than 10 ohm to greater than 100 M ohm? with tolerances as tight as 1% depending on value. The temperature stability is also very good with 100ppm/deg C being typical.

By the way, We also provided custom Multi-Wire Wipers (contacts) for customer if needs, we can manufacture the wipers according to customer's drawing design requirements or specification. More information about wipers , Please refer to Multi-Wire Wipers.

Basic Parameter of Thick Film Hybrid Circuit

1> Ceramic Substrate can be 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO), thickness range: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Thicker thickness such as 1.6mm or 2.0mm can be customized too.

2> Conductor layer materail is silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone);

3> Thickness of conductor >= 10 miron (um), and Max can be 20 micron (0.02mm)

4> Min trace width and space for volume production:0.30mm & 0.30mm, 0.20mm/0.20mm is also okay but cost will be higher, and 0.15mm/0.20mm only available for prototype.

5> Tolerance for final trace layout will be +/-5%

6> Both gold and silver palladium is workable for gold-wire bonding, but customer need to mention that so that we will use special silver palladium which is suitable for that artwork.

7> More different resistor value on the same board, more expensive board will be

8> Normally layers are 1L and 2L (with plated through hole (PTH), and plated material is the same like the one used for conductor), and maximum layers can be 10 layers

9> Soldermask is also available upon request, working temperature >500 C, and color is semi-transparent.

10> Lead out: SIP and DIP, Pitch2.54mm and1.78mm

11> Die assembly and AI wedge bonding

The most representative applications of Thick Film Carbon Hybrid Circuit are:

Application in Automotive:

Application in Industrial, Communication and National Defense:

Thick Film Hybrid Circuit for Fuel Level Sensor
Thick Film Hybrid Circuit for Ignition Module
Thick Film Hybrid Circuit for Voltage Regulator
Thick Film Hybrid Circuit for Throttle Position Sensor
Thick Film Hybrid Circuit for Idling Motor Control Module
Thick Film Hybrid Circuit for Blower Motor
Thick Film Hybrid Circuit for Mass Air Flow Sensor
Thick Film Hybrid Circuit for Accelerator Pedal Position Sensor
Thick Film Hybrid Circuit for Automatic leveling system (ALS)
Thick Film Hybrid Circuit for Hair Straightener
Thick Film Hybrid Circuit for Rotary Position Sensor

Thick Film Hybrid Circuit for Signal transfer
Thick Film Hybrid Circuit for Frequency inverter and motor control
Thick Film Hybrid Circuit for Industrial controller
Thick Film Hybrid Circuit for Lightning protection resistor
Thick Film Hybrid Circuit for Laser printer heater
Thick Film Hybrid Circuit for Outdoor equipment warmer
Thick Film Hybrid Circuit for Optical communication warmer
Thick Film Hybrid Circuit for LED heat substrate
Thick Film Hybrid Circuit for Humidity Sensitive Resistor
Thick Film Hybrid Circuit for E-Cigarettes
Thick Film Hybrid Circuit for Ceramic Ozone Generator

Engineering Specifications:

(1).Printing Accuracy: ±2 mil
(2).Printing Size: 210mm*297mm (Max)
(3).Line width, Line gape:6/ 6mil (Min)
(4).Resistor value: 10Ω~1000MΩ
(5).Precision resistor: ±1%,±2%,±5%,±0.5%
(6).Resistor accuracy: Absolute ±2%,Ratio ±0.1%
(7).Laser trim: Functional trim
(8).Print not only at Ceramic but also at Stainless, FR4, Flexible PCB
(9).Die assembly and AI wedge bonding
(10).Lead out: SIP and DIP, Pitch2.54mm and1.78mm
(11).conformal coating and molding
(12).Having ability to work in gasoline (lead-free gasoline, ethanol gasoline, methanol gasoline or low-grade gasoline) & diesel oil