Thick Film Ceramic PCB

What is Thick Film Ceramic PCB (Thick Film Hybrid Circuit)


1. Thick Film Ceramic PCB or calls Thick Film Hybrid Circuit is to incorporate reliable carbon resistors printing on the Ceramic using standard PCB processing. The printed resistor materials are based on a novel hydrophobic polyimide resin developed specifically to serve as a polymeric thick film resistors or thin film resistor material .

At the same time, using thick film technology, we can put resistor, electric capacity, conductor, semi-conductor, and interchangable conductor on ceramic board, after manufacturing steps of printing and high temperature sintering.The resistors can be laser trimming with high tolerance condition, So we can make all the resistors with the same value, or different value for different resistor on the same board.

2. Resistance range of thick film resistors can be from 40 ohms/square to 10K ohms/square,The thick film resistor or carbon resistor are printed on an etched copper or silver palladium and cured in a standard convection oven, infra-red furnace, or a thermal belt furnace. Laser trimming can be processed at this time to achieve tight tolerances.

This Thick Film Ceramic PCB solution makes resistors embedded into printed circuit boards more complex, But more versatile than the selection of surface mounted passive components. This frees up the surface space for the placement of more active components that increase functionality.

3. Thick Film Ceramic PCB technology is a new material that will improve the process of embedded resistors by eliminating the need for special termination treatment, such as immersion silver,or silver palladium, gold palladium, Also speed up the laser trim process with tighter TCR’s; and increase the reliability performance with a stable binder system.

Thus far, The environmental and mechanical testing of Thick Film Ceramic PCB processing has also been successful. Continuing to test and formulate higher resistivity values will prove these thick film resistor technology has a future in the embedded passives market.

Today Panda PCB company can also print not only at Ceramic but also at Stainless, FR4, CEM, Flexible PCB for different type of application.Thick film Ceramic can composed of active and passive components ( TR, IC, Diode, Cap, Inductors) by use various types of technical like SMT, Wire Bonds, COB, TAB. Follow with pin connection and package as call at thick film hybrid circuit.

Basic Parameter of Thick Film Ceramic Board

Ceramic Substrate can be 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO), thickness range: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Thicker thickness such as 1.6mm or 2.0mm can be customized too.

Conductor layer materail is silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone);

Thickness of conductor >= 10 miron (um), and Max can be 20 micron (0.02mm)

Min trace width and space for volume production:0.30mm & 0.30mm, 0.20mm/0.20mm is also okay but cost will be higher, and 0.15mm/0.20mm only available for prototype.

Tolerance for final trace layout will be +/-10%

Both gold and silver palladium is workable for gold-wire bonding, but customer need to mention that so that we will use special silver palladium which is suitable for that artwork.

Gold palladium is much more expensive than silver, about 10~20 times higher

More different resistor value on the same board, more expensive board will be

Normally layers are 1L and 2L (with plated through hole (PTH), and plated material is the same like the one used for conductor), and maximum layers can be 10 layers

Soldermask is also available upon request, working temperature >500 C, and color is semi-transparent.

Engineering Specifications: Typical applications:

(1).Printing Accuracy: ±2 mil
(2).Printing Size: 210mm*297mm (Max)
(3).Line width, Line gape:6/ 6mil (Min)
(4).Resistor value: 40mΩ~1000MΩ
(5).Precision resistor: ±1%,±2%,±5%,±0.5%
(6).Resistor accuracy: Absolute ±2%,Ratio ±0.1%
(7).Laser trim: Functional trim
(8).Print not only at Ceramic but also at Stainless, FR4, Flexible PCB
(9).Die assembly and AI wedge bonding
(10).Lead out: SIP and DIP, Pitch2.54mm and1.78mm
(11).conformal coating and molding
(12).Having ability to work in gasoline (lead-free gasoline, ethanol gasoline, methanol gasoline or low-grade gasoline) & diesel oil

Application in Automotive
(1)Ignition module
(2)Voltage regulator module
(3)Slow motor control module
(4)Thick film resistor for fuel level (Be used in both cars and motorcycles)
(5)Blower resistor for fan motor
(6)Mass air flow sensor
(7)Kinds of thick film PCB:
●Throttle position sensor (TPS)
●Rotary position sensor
●Wiper speed
●Automatic leveling system (ALS)
●Accelerator Pedal Position Sensor
●Fuel level sensor

Satellite Signal transmission equipment
Light dimmers
High frequency wireless communication
Heavy duty equlpment
Speed control for hand power tools
Commercial Phased Array Networks
Power conversion devices
Electric regulator