Thick Film Ceramic PCB also calls Thick Film Resistor Ceramic PCB is a technology to incorporate reliable carbon resistors printing on the Ceramic substrate using standard PCB processing. At present, Thick Film Ceramic PCB technology is quite mature that can be printed on a wide range of substrates — from high temperature ceramics to common FR4 PCB materials, or Polyimide (PI) Flex PCB Material. The printed resistor materials are based on a novel hydrophobic polyimide resin developed specifically to serve as a polymeric thick film resistors or thin film resistor material.
As Thick Film Ceramic PCB technology, we can put resistor, electric capacity, conductor, semi-conductor, and interchangable conductor on ceramic board, after manufacturing steps of printing and high temperature sintering.The resistors can be laser trimming with high tolerance condition, So we can make all the resistors with the same value, or each resistor with different value on a board. |
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Thick Film Ceramic PCB with Resistor values that can be from 10 ohms/square to 100K ohms/square (Resistor Value range ), The thick film resistor or carbon resistor are printed on an etched copper or silver palladium and cured in a standard convection oven, infra-red furnace, or a thermal belt furnace. Laser trimming can be processed at this time to achieve tight tolerances.
Thick Film Ceramic PCB solution makes resistors embedded into printed circuit boards more complex, But more versatile than the selection of surface mounted passive components. This frees up the surface space for the placement of more active components that increase functionality. |
Thick Film Ceramic PCB technology is a new material that will improve the process of embedded resistors by eliminating the need for special termination treatment, such as immersion silver,or silver palladium, gold palladium, Also speed up the laser trim process with tighter TCR’s; and increase the reliability performance with a stable binder system.Thus far, The environmental and mechanical testing of Thick Film Ceramic PCB processing has also been successful. Continuing to test and formulate higher resistivity values will prove these thick film resistor technology has a future in the embedded passives market.
Today Panda PCB company can also print not only at Ceramic but also at Stainless, FR4, CEM, Flexible PCB for different type of application.Thick film Ceramic can composed of active and passive components ( TR, IC, Diode, Cap, Inductors) by use various types of technical like SMT, Wire Bonds, COB, TAB. Follow with pin connection and package as call at thick film hybrid circuit.
In a word, Thick Film Ceramic PCB Technology can be used to deposit any combination of fixed resistors, switches, sensors, potentiometer tracks and conductors onto virtually any size, shape or PCB form.
Thick Film Ceramic PCB Technology is ideal for three-wire voltage-divider (potentiometer) designs. Here, Panda PCB offers in-process calibration and resistive (ohmic) process control, allowing for tight matching within lots and high precision voltage ratios between key points in the circuit. Once screened and cured, these resistive tracks can be individually laser trimmed to obtain very accurate tolerances in high volume.
By the way, We also offer custom Multi-Wire Wipers (contacts) for customer if needs, we can manufacture the wipers according to customer's drawing design requirements or specification. More information about wipers , Please refer to Multi-Wire Wipers. |
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Thick Film Ceramic PCB Properties: |
1,Ceramic Substrate can be 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO), thickness range: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Thicker thickness such as 1.6mm or 2.0mm can be customized too.
2, Conductor layer materail is silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone).
3, Thickness of conductor >= 10 miron (um), and Max can be 20 micron (0.02mm).
4, Min trace width and space for volume production:0.30mm & 0.30mm, 0.20mm/0.20mm is also okay but cost will be higher, and 0.15mm/0.20mm only available for prototype.
5, Tolerance for final trace layout will be +/-10%.
6, Both gold and silver palladium is workable for gold-wire bonding, but customer need to mention that so that we will use special silver palladium which is suitable for that artwork.
7, Gold palladium is much more expensive than silver, about 10~20 times higher.
8, More different resistor value on the same board, more expensive the board will be.
9, Normally layers are 1L and 2L (with plated through hole (PTH), and plated material is the same like the one used for conductor).
10, Soldermask is also available upon request, working temperature >500 C, and color is semi-transparent. |
